Investor Note - Process Control is Power Control
March 2026
Hyperscalers are beginning to resemble power utilities and large-scale infrastructure project rather than software businesses. The limiting factor is shifting toward how much reliable, energy-efficient compute can be produced per megawatt, at scale and over time.
In AI and high-performance computing, the winner is not simply the player with the highest chip manufacturing yield. It is the one that achieves the highest compute performance at energy-efficient yield.
In our investor note “Process control is power control” learn how semiconductor manufacturing defines data-center economics. Why variability is now the dominant constraint, and why process control is emerging as a distinct “asset class” in the AI power era.
Nearfield Whitepaper - Metrology Challenges in Hybrid Bonding: Enabling the Next Era of 3D Integration
January 2026
Hybrid bonding represents more than an incremental step beyond microbumps — it is a fundamental shift toward ultra-dense, energy-efficient interconnects required for the next generation of AI, HPC, and mobile devices. Yet the success of hybrid bonding does not depend on bonding technology alone.
In our latest white paper, Metrology Challenges in Hybrid Bonding: Enabling the Next Era of 3D Integration, we examine how advanced metrology is the critical enabler for high-yield, scalable 3D integration. From surface preparation and alignment to post-bond verification, every stage demands precise, reliable measurement to ensure performance and manufacturability.
As hybrid bonding moves into high-volume production, solving these metrology challenges will be essential to unlocking its full potential — and realizing the vision of seamless, reliable 3D integration.
To learn how metrology is shaping the future of hybrid bonding, click the button below.