Hybrid bonding represents more than an incremental step beyond microbumps — it is a fundamental shift toward ultra-dense, energy-efficient interconnects required for the next generation of AI, HPC, and mobile devices. Yet the success of hybrid bonding does not depend on bonding technology alone.

 

In our latest white paper, Metrology Challenges in Hybrid Bonding: Enabling the Next Era of 3D Integration, we examine how advanced metrology is the critical enabler for high-yield, scalable 3D integration. From surface preparation and alignment to post-bond verification, every stage demands precise, reliable measurement to ensure performance and manufacturability.

 

As hybrid bonding moves into high-volume production, solving these metrology challenges will be essential to unlocking its full potential — and realizing the vision of seamless, reliable 3D integration.