Nearfield Instruments Introduces Sidewall Imaging mode for advanced 3D semiconductor metrology

Nearfield Instruments introduces Sidewall Imaging Mode for advanced 3D semiconductor metrology

Real-time, non-destructive 3D process control drives innovation in energy-efficient AI chip manufacturing

San Jose, California – February 25, 2026 – Nearfield Instruments, a leader in advanced semiconductor metrology and process control, today announces the launch of its new Sidewall Imaging Mode, a measurement breakthrough for its QUADRA® high-throughput scanning probe metrology platform. The mode provides non-destructive, inline 3D sidewall profiling for high-aspect-ratio features in advanced logic and memory devices. Sidewall imaging gives chipmakers the ability to monitor next-generation semiconductors with unprecedented precision during process development and high-volume manufacturing.

As artificial intelligence (AI) drives explosive growth in global compute demand, the semiconductor industry has transitioned from flat, two-dimensional device architectures to fully three-dimensional structures such as gate-all-around (GAA), complementary FET (CFET) roadmaps, and 3D memory architectures. In these architectures, device performance is increasingly defined by the shape and quality of the vertical structures. Sidewall angle, roughness, and uniformity directly influence variability and leakage of 3D chips. At leading-edge nodes, a systematic 0.1 nm bias in critical transistor dimensions already leads to a much less energy-efficient chip, which costs a hyperscale data center operator terawatts per year, the equivalent of hundreds of millions of dollars in additional electricity costs.

Today, detailed sidewall information is primarily obtained through transmission electron microscopy (TEM), the industry’s reference standard for 3D structural analysis. While TEM delivers extremely high-resolution insight, cross-sectional TEM depends on lamella extraction and thinning, which takes the sample out of the standard production flow and inherently limits sampling volume and throughput. The patented Sidewall Imaging Mode is designed to complement these techniques by bringing 3D sidewall information inline, enabling statistically robust datasets for statistical process control (SPC) and rapid process optimization. By making third-dimension control practical at scale, the technology supports faster innovation cycles, higher manufacturing yield, and the production of more energy-efficient AI chips.

Sidewall Imaging Mode extends atomic force microscopy (AFM) using Nearfield’s patented cantilever design, sensor fusion, and trajectory control to capture both vertical and lateral interaction forces. This enables full 3D reconstruction of high-aspect-ratio features such as etched gates, nanosheets, and deep memory channels.

Dr. Hamed Sadeghian, Co-Founder and CEO of Nearfield Instruments, said: “The road to scaling compute performance is vertical, no matter the device. As devices move fully into the third dimension, process control must do the same. Sidewall Imaging Mode enables non-destructive 3D metrology with enough data to support both manufacturing precision and energy-efficient performance. This capability is fundamental for the next generation of AI-driven semiconductor technologies.”

Today, Nearfield Instruments presented the approach and showed an animation of the measurement process at SPIE Advanced Lithography + Patterning 2026 in San Jose, California. 

Sidewall Imaging Mode is unveiled to leading-edge customers and further strengthens Nearfield’s QUADRA® platform for advanced 3D logic and memory manufacturing.

Metrology Challenges in Hybrid Bonding: Enabling the Next Era of 3D Integration

Nearfield Whitepaper - Metrology Challenges in Hybrid Bonding: Enabling the Next Era of 3D Integration

Hybrid bonding represents more than an incremental step beyond microbumps — it is a fundamental shift toward ultra-dense, energy-efficient interconnects required for the next generation of AI, HPC, and mobile devices. Yet the success of hybrid bonding does not depend on bonding technology alone.
 
In our latest white paper, Metrology Challenges in Hybrid Bonding: Enabling the Next Era of 3D Integration, we examine how advanced metrology is the critical enabler for high-yield, scalable 3D integration. From surface preparation and alignment to post-bond verification, every stage demands precise, reliable measurement to ensure performance and manufacturability.
 
As hybrid bonding moves into high-volume production, solving these metrology challenges will be essential to unlocking its full potential — and realizing the vision of seamless, reliable 3D integration.
 
To learn how metrology is shaping the future of hybrid bonding, click the button below.
Download White Paper

Nearfield Instruments secures bank financing from ING

Nearfield Instruments secures bank financing from ING

Nearfield Instruments, a leader in advanced metrology for the semiconductor industry, has secured a flexible financing facility from ING to accelerate its global expansion and scale production capacity. 

This transaction marks a significant milestone in Nearfield’s growth trajectory, enabling the company to meet surging demand for its breakthrough, non-destructive metrology solutions — critical for next-generation AI chips and advanced semiconductor nodes. 

Mark Lamers, CFO of Nearfield Instruments, commented: 

“Now that Nearfield is receiving repeat orders, it has reached the point to attract bank financing. The majority of the available credit facility will be available for working capital financing, bridging the gap between cost to build a system till payment from customers. ING’s tailored financing solution facilitates to scale production as Nearfield further ramps commercially. It’s a strategic enabler for delivering on our long-term ambitions.”

Maarten Pleun Vrij, Director Technology Sector Coverage of ING added: 

“We are proud to continue to support Nearfield as a long-term partner. Previously with equity investments and in the current phase of commercial growth through senior debt financing. Our commitment reflects confidence in the Dutch Deeptech ecosystem and Nearfield’s role in shaping the future of semiconductor manufacturing. Their technology not only addresses critical industry challenges but also contributes to ESG goals by improving yield, reducing waste, and enabling more energy-efficient chip production.” 

Nearfield Instruments signs Multi-year Development Project to Advance Semiconductor Metrology

NEARFIELD INSTRUMENTS SIGNS MULTI-YEAR DEVELOPMENT PROJECT TO ADVANCE SEMICONDUCTOR METROLOGY

Rotterdam, Netherlands, November 18, 2025 – Nearfield Instruments, the leader in 3D, non-destructive, in-line process control solutions based on scanning probe technology, today announced a strategic development project to accelerate innovation in semiconductor metrology.

As part of a multi-year collaboration, Nearfield Instruments will deploy its flagship system, QUADRA, at Imec’s advanced R&D facility in Leuven. The two organizations will jointly develop next-generation metrology solutions to address critical challenges across the semiconductor manufacturing value chain, including:

  • High-NA EUV Lithography Metrology
    Development and characterization of high-NA EUV resist 3D metrology using Nearfield’s proprietary High-Aspect-Ratio (HAR) imaging mode (FFTP) to improve scanner productivity.
  • 3D Profiling of Advanced Logic Devices
    Enabling precise characterization of high-aspect-ratio structures such as Complementary Field-Effect Transistors (CFETs) through QUADRA’s proprietary side-wall imaging mode.
  • 3D Heterogeneous Integration Metrology
    Enhancing metrology and inspection capabilities for 3D integration and hybrid bonding (wafer-to-wafer, die-to-wafer).  Applications include copper pad and dielectric roughness, erosion, dishing, full-die imaging, and edge roll-off, leveraged by Nearfield Instruments’ Ultra-Large Scanning Area (ULSA) technology, which combines high throughput with nanometer-level resolution.

“Partnering with Imec allows us to push the boundaries of what is possible in semiconductor manufacturing process control,” said Dr. Hamed Sadeghian, CEO of Nearfield Instruments. “Together, we’re tackling grand metrology challenges, from 3D profiling of CFETs to hybrid bonding characterization, and enabling the next leap in High-NA EUV lithography through full 3D resist imaging. These innovations are critical for the AI-chip era, where precision, speed, and scalability in metrology directly determine performance, energy efficiency, and yield. QUADRA is built to meet those demands.”

Luc van den Hove, CEO of Imec adds: “Advanced metrology solutions are essential to overcoming the complex challenges facing the semiconductor industry today. By combining state-of-the-art research and innovative technologies, we are paving the way for transformative advancements that will support the future of chip manufacturing and enable the continued progress of the digital era. We are happy to see European initiatives to develop advanced equipment solutions addressing some of the pressing needs and want to leverage our pilot line to demonstrate some of these capabilities.”

This collaboration marks a significant step forward in bridging cutting-edge metrology innovation with advanced semiconductor process development. By combining Nearfield Instruments’ proven technology with Imec’s visionary research programs, the partnership aims to deliver impactful solutions that will shape the future of chip manufacturing.

ABOUT NEARFIELD INSTRUMENTS

Based in Rotterdam, Netherlands, Nearfield Instruments specializes in advanced metrology and inspection solutions for the semiconductor industry. The company develops and commercializes next-generation scanning probe microscopy systems that deliver true 3D nanometer-scale metrology.
At the heart of Nearfield’s innovation is its proprietary platform QUADRA, which enables non-destructive, high-throughput, atomic force microscopy (AFM) with full 3D imaging capabilities, including full side-wall measurement. This allows semiconductor manufacturers to precisely measure complex structures such as high-aspect-ratio trenches, vias, and multi-layered stacks, which are increasingly critical in advanced nodes and 3D IC packaging. The company’s solutions are designed for seamless integration into high-volume manufacturing environments, offering robust automation, fast measurement cycles, and compatibility with fab standards, enabling the next generation of semiconductor manufacturing innovation in line with industry needs.

For more information, visit nearfieldinstruments.com

Media Contact: Roland van Vliet Chief Partnership Officer Nearfield Instruments B.V.

roland.vanvliet@nearfieldinstruments.com

+31 6 20 36 97 41

Nearfield Instruments receives Technology Fast50 Deep Tech Award

Nearfield Instruments receives Technology Fast50 Deep Tech Award

We’re proud to announce that Nearfield Instruments has received the Technology Fast50 Deep Tech Award — a recognition for companies that demonstrate outstanding innovation, scalability, and growth potential in deep-tech domains. This award celebrates emerging technology companies with long development cycles and bold ambitions to transform their industries. 

Nearfield Instruments plays a pivotal role at the intersection of AI, semiconductors, and European innovation. By enabling chip manufacturers to improve production yield and shorten the development cycle of next-generation chips, Nearfield’s innovations reinforce Europe’s technological sovereignty and global competitiveness in semiconductor manufacturing. 

Hamed Sadeghian, Co-Founder and CEO of Nearfield Instruments, accepted the award on behalf of all employees, stating: “This recognition is a testament to the vision, talent, and dedication of our entire team. We are proud to be pushing the boundaries of what’s possible in semiconductor metrology and to contribute to the continued evolution of the global technology landscape.” 

Congratulations to our entire team and to everyone who supports our mission: Power to Compute is Power to Compete. 

Nearfield Instruments and Singapore’s A*STAR IME Sign Research Collaboration Agreement to Advance Semiconductor Metrology Solutions for AI and Advanced Packaging Era

Nearfield Instruments and Singapore’s A*STAR IME Sign Research Collaboration Agreement to Advance Semiconductor Metrology Solutions for AI and Advanced Packaging Era

Singapore, 20 May 2025 – Nearfield Instruments, a leader in advanced semiconductor metrology and the A*STAR Institute of Microelectronics (A*STAR IME) of Singapore, today have signed a multi-year research collaboration agreement to drive innovation in semiconductor metrology technologies.

By leveraging Nearfield Instruments’ expertise in high-precision metrology and A*STAR IME’s cutting-edge semiconductor research, the partnership will accelerate the development of advanced metrology solutions that enable efficient AI chip production.

The rapid rise of AI is driving an explosive demand for compute power, presenting opportunities for innovation in semiconductor technology. As traditional semiconductor scaling reaches its limits, the industry is turning to heterogeneous integration—the advanced packaging of different types of chips into a single system—to achieve exceptional compute performance and enhanced energy efficiency. This shift introduces greater complexity in manufacturing and underscores the critical importance of process control and precision metrology to ensure production yield and efficiency.

“AI is changing everything but its success depends on compute efficiency as well as manufacturing efficiency,” said Hamed Sadeghian, CEO of Nearfield Instruments. “Nearfield enables the AI revolution by providing the metrology solutions needed to tackle the challenges of heterogeneous integration, with a specific focus on hybrid bonding. By ensuring precision and reliability, we help manufacturers scale AI chips efficiently, improve yields, and reduce energy waste. Our collaboration with A*STAR IME strengthens our ability to develop breakthrough solutions for the future of AI-driven computing.”

“A*STAR IME works closely with industry partners to translate research into impactful solutions for the global semiconductor industry. Our collaboration with Nearfield Instruments will drive innovation in metrology, to achieve the high yield and energy-efficient manufacturing of AI and high-performance computing chips,” said Terence Gan, Executive Director of A*STAR IME.

This collaboration aligns with Singapore’s continuous efforts to strengthen its semiconductor industry through strategic partnerships with global technology leaders. “This partnership highlights Singapore’s commitment to support cutting-edge semiconductor process control research, critical for the development of next generation semiconductors used in applications such as AI,” said Mr Chang Chin Nam, Senior Vice President and Head of Semiconductors, Singapore Economic Development Board. “We welcome Nearfield’s activities in Singapore and look forward to further research and supply chain collaborations within Singapore’s growing semiconductor ecosystem.”

 About Nearfield Instruments

Nearfield Instruments is a leading provider of advanced metrology solutions for the semiconductor industry. Specializing in high-precision measurement technologies, Nearfield plays a critical role in enabling the process control required for next-generation AI chips and heterogeneous integration. As part of its global expansion, Nearfield has established Nearfield Singapore, an innovation and service hub dedicated to supporting semiconductor manufacturers across Southeast Asia.

For more information, visit www.nearfieldinstruments.com.

About A*STAR

The Agency for Science, Technology and Research (A*STAR) is Singapore’s lead public sector R&D agency. Through open innovation, we collaborate with our partners in both the public and private sectors to benefit the economy and society. As a Science and Technology Organisation, A*STAR bridges the gap between academia and industry. Our research creates economic growth and jobs for Singapore, and enhances lives by improving societal outcomes in healthcare, urban living, and sustainability. A*STAR plays a key role in nurturing scientific talent and leaders for the wider research community and industry. A*STAR’s R&D activities span biomedical sciences to physical sciences and engineering, with research entities primarily located in Biopolis and Fusionopolis. For ongoing news, visit www.a-star.edu.sg.

Follow A*STAR on Facebook | LinkedIn | Instagram | YouTube | TikTok

For media inquiries, please contact:
Roland van Vliet
Chief Partnership Officer
Nearfield Instruments B.V.
roland.vanvliet@nearfieldinstruments.com
+31-6-20 36 97 41

Appointment of Max (Masoud) Mirgoli as independent Supervisory Board member of Nearfield Instruments

Appointment of Max (Masoud) Mirgoli as independent Supervisory Board member of Nearfield Instruments

Nearfield Instruments B.V. (Nearfield) is pleased to announce the appointment of Max Mirgoli as independent Supervisory Board Member of Nearfield Instruments as per May 2025.

 “We extend a warm welcome to Max Mirgoli” said CEO Hamed Sadeghian. “We are very pleased to bring Max onboard as he brings a wealth of experience in the global semiconductor industry, including serving at IMEC since 2010 as EVP of Global Strategic Partnerships and member of the Executive Board at IMEC”.

Max Mirgoli added: “It is a privilege to be appointed to the Supervisory board of Nearfield Instruments as the world class and talented team of Nearfield have come up with a truly unique and Innovative platform that will further help solve great challenges of Semiconductor manufacturing. I am delighted to be working with the rest of the esteemed board members to ensure the success of the team under the capable leadership of Dr Sadeghian. They can count on my outmost support.”

With over 240 employees, Nearfield Instruments B.V. delivers in-line process control solutions to the high-volume semiconductor manufacturing industry based on their ground-breaking non-destructive, high-throughput 3D Atomic Force Microscopy technology. Nearfield is headquartered in Rotterdam, NL with offices in Eindhoven, South Korea, Japan, and the US.

Nearfield Instruments receives Purchase Orders from Major US customer, and establishes Nearfield Instruments USA Inc.

Nearfield Instruments receives Purchase Orders from Major US customer, establishes Nearfield Instruments USA Inc.

Nearfield Instruments, a leading provider of advanced metrology and inspection solutions for the semiconductor industry, is pleased to announce the establishment of its U.S. subsidiary, Nearfield Instruments USA Inc. This strategic move strengthens the company’s presence in North America, allowing it to better support customers in the region and accelerate the adoption of its cutting-edge metrology technologies. The incorporation of Nearfield Instruments USA Inc. is further driven by the receival of multiple system orders from a US customer, reinforcing the company’s growth trajectory and market demand for its innovative metrology solutions. “We’re excited to share that our flagship product QUADRA has been selected by our US customer as part of the development of its newest production technology. What a great way to launch Nearfield’s business in the US,” according to Jeroen Verbiest, VP Sales & Marketing of Nearfield Instruments.

Nearfield Instruments USA Inc. specializes in high-precision, non-destructive metrology and inspection solutions that enable semiconductor manufacturers to achieve unprecedented accuracy in process control at the nanoscale. As the demand for higherperformance semiconductor devices continues to grow, Nearfield’s innovative solutions play a crucial role in ensuring manufacturing efficiency and yield optimization.

“With the expansion of our operations in North America, we are reaffirming our commitment to supporting our worldwide customers with state-of-the-art process control solutions,” said Hamed Sadeghian, CEO of Nearfield Instruments. “The semiconductor industry is evolving rapidly, and our technology enables our customers to push the boundaries of what’s possible with next-generation chip production. We are pleased to have now commercial and operational presence on all semiconductorrelevant continents.”

The expansion includes the opening of several office and technical locations throughout the year, which will serve as hubs for customer support, collaborative innovation and supply operations. This move is aimed at fostering closer partnerships with leading semiconductor companies, and industry stakeholders.

Nearfield Instruments is dedicated to driving technological advancements in semiconductor metrology and remains focused on delivering solutions that meet the ever-growing complexity of semiconductor manufacturing. With this US expansion, the company is well-positioned to support the US semicon manufacturing industry. 

New Repeat Orders for QUADRA High-Throughput Metrology System from Leading Semiconductor Manufacturer fills up Nearfield Instruments’ 2025 Order Book

New Repeat Orders for QUADRA High-Throughput Metrology System from Leading Semiconductor Manufacturer fills up Nearfield's 2025 Order Book

Rotterdam, Netherlands – December 23, 2024 – Nearfield Instruments is proud to announce that it has received repeat purchase orders for its flagship QUADRA High-Throughput Process Control Metrology System. This follow-up order highlights Nearfield Instruments’ increasing market traction and its success in penetrating high-volume manufacturing operations.

The QUADRA system offers cutting-edge capabilities for in-line process control by Nearfield’s high-throughput AFM metrology technologies that deliver highly accurate, non-destructive 3D measurements of critical semiconductor parameters. By providing real-time feedback on critical device structures, the system provides good correlation to device yield and enables manufacturers to maintain high yields and optimal performance in their production lines. QUADRA’s exceptional throughput allows manufacturers to quickly and accurately analyze large numbers of devices without compromising measurement precision, ensuring both efficiency and quality in the production process.

This follow-on order from a leading semiconductor manufacturer reflects the confidence that global manufacturers are placing in the QUADRA platform as they scale to meet the demands of next-generation technologies.

“This repeat order is a clear validation of the QUADRA system’s performance, both in terms of capability and expected reliability and customer support and responsiveness and its critical role in enabling high-volume manufacturing for cutting-edge semiconductor processes,” said Hamed Sadeghian, CEO of Nearfield Instruments. “It demonstrates not only the system’s technical excellence but also the trust our customers place in us to support their production goals. With this new repeat orders, our order book for 2025 is fully filled and underlines Nearfield Instruments’ dedication to providing innovative solutions that help manufacturers achieve new heights of efficiency and yield.”

The continued adoption of QUADRA systems by leading manufacturers further strengthens Nearfield Instruments’ position as a driving force in advanced process control metrology for mass production.

Nearfield Instruments Receives Purchase Order for QUADRA High-Throughput Metrology System from Leading Semiconductor Manufacturer in East Asia

Nearfield Instruments Receives Purchase Order for QUADRA High-Throughput Metrology System from Leading Semiconductor Manufacturer in East Asia

Rotterdam, Netherlands – October 18, 2024 – Nearfield Instruments, a leading innovator in advanced process control metrology solutions, is proud to announce the receipt of a purchase order for its flagship QUADRA High-Throughput Process Control Metrology product. The order, secured after an intensive supplier selection process, was placed by a prominent semiconductor manufacturer in East Asia, further strengthening Nearfield Instruments’ presence in this technologically advanced region.

The QUADRA system was selected following a competitive evaluation process, where it outperformed alternative metrology solutions in several key areas critical to advanced semiconductor manufacturing. The decision was driven by the following decisive factors:

  1. Direct Correlation to Device Yield: Extensive testing of QUADRA demonstrated a direct correlation between its measurement results and device yield (via E-test), a critical consideration for the customer’s high-performance semiconductor fabrication processes.
  2. Non-Destructive Measurement Capability: The QUADRA system stood out for its ability to conduct accurate, non-destructive measurements. After rigorous testing, QUADRA proved its reliability, showing no impact on the integrity of sensitive semiconductor components even under the most demanding conditions.
  3. Superior Throughput with Stability and Accuracy: QUADRA’s ability to deliver high throughput without compromising on accuracy and stability was a significant differentiator. The system’s superior speed, paired with precision, enables manufacturers to maintain peak production efficiency while ensuring stringent quality control.
  4. Outstanding Customer Support and Responsiveness: Nearfield Instruments’ reputation for exceptional customer support and responsiveness was a major contributing factor in the customer’s decision. The company’s commitment to providing continuous support throughout the evaluation and decision-making process was highly valued by the customer.

This strategic win marks a significant step in Nearfield Instruments’ ongoing expansion in East Asia. It reflects the growing recognition of QUADRA’s industry-leading capabilities in process control metrology, reinforcing the system’s role in driving mass production yield and quality for advanced semiconductor manufacturing.

 

“We are pleased to receive this important order from yet another highly respected semiconductor manufacturer in East Asia,” said Hamed Sadeghian, CEO of Nearfield Instruments. “It underscores the confidence our customers have in the QUADRA system’s ability to meet the demands of next-generation semiconductor fabrication, as well as the strength of our customer service and support. As semiconductor production processes become increasingly complex, Nearfield Instruments remains committed to delivering cutting-edge metrology systems that address the evolving challenges faced by manufacturers worldwide.”